Invention Grant
- Patent Title: Coil device
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Application No.: US16492770Application Date: 2018-07-02
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Publication No.: US11322984B2Publication Date: 2022-05-03
- Inventor: Kenji Nishimura
- Applicant: IHI Corporation
- Applicant Address: JP Tokyo
- Assignee: IHI Corporation
- Current Assignee: IHI Corporation
- Current Assignee Address: JP Tokyo
- Agency: Volpe Koenig
- Priority: JPJP2017-132036 20170705
- International Application: PCT/JP2018/025053 WO 20180702
- International Announcement: WO2019/009241 WO 20190110
- Main IPC: H02J50/12
- IPC: H02J50/12 ; H02J50/80 ; H02J50/60 ; B60L53/12 ; H01F38/14 ; H02J5/00 ; H04B5/00

Abstract:
A coil device includes a base, a cover facing the base and forming a receiving space between the base and the cover, a casing disposed inside the receiving space and containing a coil therein, a substrate disposed inside the receiving space and having a through hole passing through the substrate along a facing direction of the base and the cover, and a support portion disposed in the through hole, wherein the support portion has a strength greater than a strength of the substrate and wherein the support portion has a height greater than a thickness of the substrate.
Public/Granted literature
- US20200070673A1 COIL DEVICE Public/Granted day:2020-03-05
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