Invention Grant
- Patent Title: Tetracell image sensor preforming binning
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Application No.: US16815186Application Date: 2020-03-11
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Publication No.: US11323640B2Publication Date: 2022-05-03
- Inventor: Moo Young Kim , Minho Kwon , Dongki Min , Seonghye Park , Eunjik Yi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2019-0034580 20190326
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H04N5/347 ; H04N9/04

Abstract:
Systems and methods are described for a tetracell image sensor that performs diamond binning to process image data. An image sensor includes a pixel array and a converting circuit, where the pixel array includes pixel sets arranged in a row direction and a column direction, outputs a first signal generated from a first pixel set of the pixel sets, and outputs a second signal generated from a second pixel set of the pixel sets. The converting circuit performs binning based on the first signal and the second signal to generate a first binning signal. Each of the first pixel set and the second pixel set includes pixel sensors adjacent to each other, and the first pixel set and the second pixel set are located at different rows and different columns.
Public/Granted literature
- US20200314364A1 TETRACELL IMAGE SENSOR PREFORMING BINNING Public/Granted day:2020-10-01
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