Invention Grant
- Patent Title: Sound output assembly
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Application No.: US16938392Application Date: 2020-07-24
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Publication No.: US11323791B2Publication Date: 2022-05-03
- Inventor: Akiyoshi Sato
- Applicant: YAMAHA CORPORATION
- Applicant Address: JP Hamamatsu
- Assignee: YAMAHA CORPORATION
- Current Assignee: YAMAHA CORPORATION
- Current Assignee Address: JP Hamamatsu
- Agency: Rossi, Kimms & McDowell LLP
- Main IPC: H04R1/02
- IPC: H04R1/02 ; H04R1/06 ; H04R1/32

Abstract:
A sound output assembly includes an enclosure, a circuit board disposed in the enclosure, and including signal processing circuitry, and a speaker assembly. The speaker assembly includes a main body disposed inside the enclosure, and a supporting member configured to support the main body and having (i) a first portion fixed to the main body such that the first portion of the supporting member and the main body are formed as one body and (ii) a second portion fixed to the circuit board or to the enclosure. The main body includes an acoustic diaphragm in accordance with a signal supplied from the signal processing circuitry. The supporting member is configured to dampen vibration of the main body.
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