Invention Grant
- Patent Title: RF thermal increase systems with multi-level electrodes
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Application No.: US16401540Application Date: 2019-05-02
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Publication No.: US11324082B2Publication Date: 2022-05-03
- Inventor: Jamison Michael McCarville , Lionel Mongin , Pierre Marie Jean Piel
- Applicant: NXP USA, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Agent Sherry Gourlay
- Main IPC: H05B6/54
- IPC: H05B6/54 ; H05B1/02 ; H05B6/50 ; H05B6/62

Abstract:
A thermal increase system includes one or more multi-level electrodes configured to radiate electromagnetic energy into a cavity in response to receiving a radio frequency (RF) signal from an RF signal source. Each multi-level electrode is positioned adjacent to a wall of the cavity, and each multi-level electrode includes a base portion coupled to an elevated portion. A radiating surface of the elevated portion is at a height of at least 0.5 centimeters (cm) from a radiating surface of the base portion.
Public/Granted literature
- US20200351992A1 RF THERMAL INCREASE SYSTEMS WITH MULTI-LEVEL ELECTRODES Public/Granted day:2020-11-05
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