Invention Grant
- Patent Title: Wiring substrate and module
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Application No.: US17171252Application Date: 2021-02-09
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Publication No.: US11324108B2Publication Date: 2022-05-03
- Inventor: Shota Sato
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JPJP2018-163758 20180831
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K3/28
Abstract:
A module (101) includes a substrate (1) having a main surface (1a) and a conductor column (4) disposed on the main surface (1a). The conductor column (4) includes a conductor column body (4a) and an overhanging part (4b) overhanging from an outer periphery of the conductor column body (4a) in a middle of a height direction of the conductor column body (4a).
Public/Granted literature
- US20210168928A1 WIRING SUBSTRATE AND MODULE Public/Granted day:2021-06-03
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