Invention Grant
- Patent Title: Circuit board and connector
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Application No.: US16903959Application Date: 2020-06-17
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Publication No.: US11324118B2Publication Date: 2022-05-03
- Inventor: Peng Wei
- Applicant: Tyco Electronics (Shanghai) Co. Ltd.
- Applicant Address: CN Shanghai
- Assignee: Tyco Electronics (Shanghai) Co. Ltd.
- Current Assignee: Tyco Electronics (Shanghai) Co. Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Barley Snyder
- Priority: CN201910543120.9 20190621
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18 ; H05K1/02 ; H05K3/40
Abstract:
A circuit board includes a plurality of signal contact pads each electrically contacting a contact point of one of a plurality of signal terminals and a non-conductive through hole extending through the circuit board in an interval area between a pair of adjacent signal contact pads of the plurality of signal contact pads.
Information query
