Invention Grant
- Patent Title: Flexible printed circuit board
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Application No.: US16488755Application Date: 2018-02-26
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Publication No.: US11324120B2Publication Date: 2022-05-03
- Inventor: Tsuyoshi Takemoto , Hiroshi Ueda
- Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Applicant Address: JP Koka
- Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Current Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Current Assignee Address: JP Koka
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JPJP2017-044415 20170308
- International Application: PCT/JP2018/006906 WO 20180226
- International Announcement: WO2018/163878 WO 20180913
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/02 ; H05K1/03 ; H05K1/18 ; H01F17/04 ; H01F17/00 ; H05K1/11

Abstract:
A flexible printed circuit board includes: an electrically insulating substrate layer; an electrically conductive pattern stacked on at least one surface of the substrate layer; and a cover layer that is disposed on a stack including the substrate layer and the electrically conductive pattern and covers a surface of the stack, which surface is on the side on which the electrically conductive pattern is present. The electrically conductive pattern has a coil region including a coil. In the substrate layer or the cover layer, a high-magnetic permeability member is present in at least a region that overlaps the coil region in plan view.
Public/Granted literature
- US20210068255A1 FLEXIBLE PRINTED CIRCUIT BOARD Public/Granted day:2021-03-04
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