Invention Grant
- Patent Title: Diversified assembly printed circuit board and method for making the same
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Application No.: US17106142Application Date: 2020-11-29
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Publication No.: US11324125B2Publication Date: 2022-05-03
- Inventor: Ke Leng , Hailong Liu , Jinfeng Liu , Fengwu Wu , Li Chen , Lihua Zhang
- Applicant: SHENNAN CIRCUITS CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENNAN CIRCUITS CO., LTD.
- Current Assignee: SHENNAN CIRCUITS CO., LTD.
- Current Assignee Address: CN Shenzhen
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/09 ; H05K1/18 ; H05K3/00 ; H05K3/10 ; H05K3/24 ; H05K3/36 ; H05K3/40 ; H05K3/42 ; H05K3/46 ; H01L21/44 ; H01L21/48 ; H01L21/60 ; H01L21/70 ; H01L21/268 ; H01L21/768 ; H01L23/00 ; H01L23/31 ; H01L23/66 ; H01L23/367 ; H01L23/373 ; H01L23/498 ; H01L23/522 ; H01L23/538 ; H05K3/34 ; H05K1/14
Abstract:
A diversified assembly printed circuit board includes a first printed circuit board provided with a multiple first conductive metals protruding from a surface of the first printed circuit board, and a multiple second printed circuit boards each provided with a multiple second conductive metals protruding from a surface of the each of the second printed circuit boards. At a connection position, solidified conductive metal paste is arranged between each of the first conductive metals and a corresponding second conductive metal to electrically connect each of the first conductive metals and the corresponding second conductive metal. A laminated adhesive sheet is arranged between each of the second printed circuit boards and the first printed circuit board to physically connect the second printed circuit boards and the first printed circuit board.
Public/Granted literature
- US20210084773A1 DIVERSIFIED ASSEMBLY PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME Public/Granted day:2021-03-18
Information query
