Invention Grant
- Patent Title: Housing structure for electronic boards
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Application No.: US16966545Application Date: 2019-01-31
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Publication No.: US11324136B2Publication Date: 2022-05-03
- Inventor: Mauro Rossi , Ugo Padulosi , Gianpaolo Zanier
- Applicant: EUROTECH S.p.A.
- Applicant Address: IT Amaro
- Assignee: EUROTECH S.p.A.
- Current Assignee: EUROTECH S.p.A.
- Current Assignee Address: IT Amaro
- Agency: Calfee Halter & Griswold LLP
- Priority: IT102018000002318 20180201
- International Application: PCT/IT2019/050024 WO 20190131
- International Announcement: WO2019/150407 WO 20190808
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K7/20 ; G06F1/18

Abstract:
Housing structure for PCI Express expansion electronic boards able to mechanically stabilize said PCI Express expansion electronic boards so as to guarantee the correct functioning, performance and integrity of the electric interconnection between them and the basic electronic board to which they are connected if there are mechanical stresses such as knocks or vibrations, in order to be able to use PCI Express expansion electronic boards in the automotive field, or in scenarios characterized by perturbations of the important mechanical type. The present invention also concerns an assembly method of the housing structure.
Public/Granted literature
- US20210051813A1 HOUSING STRUCTURE FOR ELECTRONIC BOARDS Public/Granted day:2021-02-18
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