Invention Grant
- Patent Title: Thermal incision apparatus, system and method
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Application No.: US16141253Application Date: 2018-09-25
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Publication No.: US11324541B2Publication Date: 2022-05-10
- Inventor: Philip E. Eggers
- Applicant: Eggers & Associates, LLC
- Applicant Address: US OH Dublin
- Assignee: Eggers & Associates, LLC
- Current Assignee: Eggers & Associates, LLC
- Current Assignee Address: US OH Dublin
- Agency: Mueller Law, LLC
- Agent Jerry K. Mueller, Jr.
- Main IPC: A61B18/10
- IPC: A61B18/10 ; A61B18/08 ; A61B18/14 ; A61B18/00

Abstract:
Thermal cutting surgical instruments incorporate a blade incorporating a first substrate of high thermal conductivity material in the heated portion of the blade and a support and, the first substrate of high thermal conductivity material joined to a second substrate of low thermal conductivity material in the support region of the blade; an electrically insulative dielectric layer disposed on the first surface of the first substrate and on the first surface of second substrate; an electrically resistive heating element disposed on the electrically insulative dielectric; electrically conductive power leads and electrically conductive sense leads disposed on the electrically insulative dielectric layer and that are in electrical communication with the electrically resistive heating element; and an electrically insulative dielectric overcoat layer disposed on the electrically resistive heating element and on the distal portion of the electrically conductive power leads and electrically conductive sense leads.
Public/Granted literature
- US20190099210A1 Thermal Incision Apparatus, System and Method Public/Granted day:2019-04-04
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