Invention Grant
- Patent Title: Biomaterials for enhanced implant-host integration
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Application No.: US17213423Application Date: 2021-03-26
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Publication No.: US11324858B2Publication Date: 2022-05-10
- Inventor: Christopher S. Chen , Jan D. Baranski , Ritika Chaturvedi , Michael T. Yang , Kelly R. Stevens , Sangeeta N. Bhatia
- Applicant: Massachusetts Institute of Technology , The Trustees of the University of Pennsylvania
- Applicant Address: US MA Cambridge; US PA Philadelphia
- Assignee: Massachusetts Institute of Technology,The Trustees of the University of Pennsylvania
- Current Assignee: Massachusetts Institute of Technology,The Trustees of the University of Pennsylvania
- Current Assignee Address: US MA Cambridge; US PA Philadelphia
- Agency: McCarter & English, LLP
- Main IPC: A61K35/44
- IPC: A61K35/44 ; A61L27/50 ; A61L27/36 ; A61L27/38 ; A61L27/22 ; A61L27/24 ; A61L27/40

Abstract:
The present disclosure provides patterned biomaterials having organized cords and extracellular matrix embedded in a 3D scaffold. According, the present disclosure provides compositions and applications for patterned biomaterials. Pre-patterning of these biomaterials can lead to enhanced integration of these materials into host organisms, providing a strategy for enhancing the viability of engineered tissues by promoting vascularization.
Public/Granted literature
- US20210213171A1 BIOMATERIALS FOR ENHANCED IMPLANT-HOST INTEGRATION Public/Granted day:2021-07-15
Information query
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