A machining swarf removing apparatus includes a left and a right machining swarf removing units. When removing machining swarf adhered to a recovery box, the left machining swarf removing unit is placed in removal starting position. A brush enters an insertion-ready state in which transverse direction thereof is oriented in a second direction D2. The brush is moved to an insertion position for insertion into the recovery box, then the brush is rotated to enter a machining swarf removal-ready state in which a longitudinal direction thereof is oriented in the second direction D2. The left machining swarf removing unit is moved to remove the machining swarf adhered to the recovery box by the brush, while a left rod vibrating device is driven to vibrate a rod, vibrating the brush attached to the rod.