A mold (1) according to an embodiment of the present invention is a mold which is formed by additive manufacturing. The mold includes: a heat medium channel (10) for a heat medium to flow through, the heat medium channel being provided inside the mold; a medium introduction port (4) at which the heat medium is to be introduced into the mold; a medium discharge port (5) at which the heat medium is to be discharged out of the mold; and a buffer layer (20) located between a mold surface (1a) and the heat medium channel. The buffer layer includes a low-melting percentage portion (21) having a lower melting percentage than does any portion inside the mold other than the buffer layer.