- Patent Title: Porous polyurethane polishing pad and method for manufacturing same
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Application No.: US16462180Application Date: 2018-01-09
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Publication No.: US11325222B2Publication Date: 2022-05-10
- Inventor: Hye Young Heo , Jang Won Seo , Hyuk Hee Han
- Applicant: SKC solmics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: SKC solmics Co., Ltd.
- Current Assignee: SKC solmics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2017-0005301 20170112
- International Application: PCT/KR2018/000415 WO 20180109
- International Announcement: WO2018/131868 WO 20180719
- Main IPC: B24B37/24
- IPC: B24B37/24 ; B29C44/02 ; C08G18/08 ; C08G18/10 ; C08G18/48 ; C08G18/76 ; C08J9/00 ; C08J9/38 ; C08K5/17 ; C08K5/35 ; C08L75/04 ; H01L21/304 ; H01L21/3105 ; H01L21/321 ; C08G101/00
Abstract:
An embodiment relates to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. In the porous polyurethane polishing pad, the polishing performance (or polishing rate) thereof can be controlled by adjusting the size and distribution of pores in the polishing pad.
Public/Granted literature
- US20190329376A1 POROUS POLYURETHANE POLISHING PAD AND METHOD FOR MANUFACTURING SAME Public/Granted day:2019-10-31
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