Invention Grant
- Patent Title: Fluid ejection dies
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Application No.: US16965689Application Date: 2018-03-12
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Publication No.: US11325379B2Publication Date: 2022-05-10
- Inventor: Garrett E. Clark
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Fabian VanCott
- International Application: PCT/US2018/022041 WO 20180312
- International Announcement: WO2019/177581 WO 20190919
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A fluid ejection die may include a number of fluid ejection chambers laid to correlate with a number of dividers formed in a fluid channel layer such that adjacent fluid ejection chambers are alternatively arranged on a relatively higher-temperature side of the fluid ejection die and a relatively lower-temperature side of the fluid ejection die.
Public/Granted literature
- US20210039392A1 FLUID EJECTION DIES Public/Granted day:2021-02-11
Information query
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