A cushioning packaging material for packaging one or more electronic products and the like is disclosed. The cushioning packaging material includes a cushioning portion provided with a plurality of air pockets, an air distribution portion provided with a distribution passage through which air is distributed into the plurality of air pockets, and an air inlet provided at one side of the air distribution portion. The air inlet is closed after completion of air injection. Thus, air leakage through the air inlet is prevented and cushioning force reduction caused by air leakage is also prevented.