Invention Grant
- Patent Title: Polyamide resin, molded body, laminate, medical device, and polyamide resin production method
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Application No.: US16348011Application Date: 2017-11-09
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Publication No.: US11326024B2Publication Date: 2022-05-10
- Inventor: Takayuki Kato
- Applicant: KANEKA CORPORATION
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2016-220057 20161110
- International Application: PCT/JP2017/040478 WO 20171109
- International Announcement: WO2018/088496 WO 20180517
- Main IPC: C08G69/36
- IPC: C08G69/36 ; C08G69/08 ; C08G69/14 ; C08G69/28 ; C08G69/40

Abstract:
A polyamide resin with an excellent balance of mechanical characteristics such as breaking strength and breaking elongation in a solid state, a molded body containing said polyamide resin, a laminate provided with a film or a sheet containing said polyamide resin, a medical device provided with the aforementioned molded body and/or the aforementioned laminate, and a production method of the aforementioned polyamide resin are provided. A polyamide resin is used which contains: a linear aliphatic dicarbonyl unit as unit (a); a linear aliphatic diamino unit as unit (b); at least one of a unit (b) and a unit (c), each of a prescribed structure; and a trivalent unit (e).
Public/Granted literature
- US20210277183A1 POLYAMIDE RESIN, MOLDED BODY, LAMINATE, MEDICAL DEVICE, AND POLYAMIDE RESIN PRODUCTION METHOD Public/Granted day:2021-09-09
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