Solvent composition, adhesive composition, and method of bonding surfaces
Abstract:
In an embodiment a solvent composition can comprise, based on the total volume of the solvent composition, 10 to 95 volume percent of a first solvent, wherein the first solvent has Hansen solubility parameters of: 15 MPa0.5≤δD≤17 MPa0.5, 4≤δP≤10.5 MPa0.5, and 7≤δH≤10 MPa0.5; 5 to 95 volume percent of a second solvent, wherein the second solvent has Hansen solubility parameters of: 16 MPa0.5≤δD≤17.5 MPa0.5, 0≤δP≤3 MPa0.5, and 0≤δH≤3 MPa0.5; and 0 to 85 volume percent parachlorobenzotrifluoride; wherein the amounts of the first solvent, the second solvent, and parachlorobenzotrifluoride sum to at least 85 volume percent. The first solvent can comprise methyl acetate, acetone, dimethyl carbonate, ethyl acetate, n-butylamine, propyl acetate, tetrahydrofuran, or a combination thereof. The second solvent can comprise cyclohexene, cyclohexane, cyclopentane, methylcyclohexane, or a combination thereof. The solvent compositions are particularly useful in an adhesive composition. An adhesive composition includes the solvent composition, a rubber, and a tackifying resin. A method of bonding two surfaces is also described.
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