Invention Grant
- Patent Title: Aqueous bonding composition
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Application No.: US15883239Application Date: 2018-01-30
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Publication No.: US11326079B2Publication Date: 2022-05-10
- Inventor: Atsushi Kakuda , Yoshio Yoshida
- Applicant: HENKEL AG & CO. KGAA
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL AG & CO. KGAA
- Current Assignee: HENKEL AG & CO. KGAA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann; Steven C. Bauman
- Main IPC: C09J105/00
- IPC: C09J105/00 ; C09D105/00 ; C08L97/02 ; B32B21/04 ; C08K3/28 ; C08K3/32 ; C08K5/17 ; B27N3/00 ; B27N7/00

Abstract:
Disclosed is an aqueous bonding composition comprising: (A) a saccharide; (B) a phosphate; and (C) at least one neutralizing agent selected from ammonia and an amine compound having at least one hydroxyl group. The aqueous bonding composition is excellent in balance among bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient and peeling strength and scarcely causes metal to rust. The aqueous bonding composition can be usefully used to produce a wood-based material.
Public/Granted literature
- US20180155584A1 AQUEOUS BONDING COMPOSITION Public/Granted day:2018-06-07
Information query
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