Invention Grant
- Patent Title: Method for connecting molded bodies by injecting a single-component heat-curing epoxy resin composition into cavities
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Application No.: US16614714Application Date: 2018-06-22
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Publication No.: US11326081B2Publication Date: 2022-05-10
- Inventor: Noah Munzinger , Antonio Voci , Urs Rheinegger
- Applicant: SIKA TECHNOLOGY AG
- Applicant Address: CH Baar
- Assignee: SIKA TECHNOLOGY AG
- Current Assignee: SIKA TECHNOLOGY AG
- Current Assignee Address: CH Baar
- Agency: Oliff PLC
- Priority: EP17177416 20170622
- International Application: PCT/EP2018/066735 WO 20180622
- International Announcement: WO2018/234534 WO 20181227
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C09J5/06 ; C09J11/08

Abstract:
A method of bonding two shaped bodies S1 and S2 including the steps of: a) providing shaped body S1; b) arranging shaped body S2 wherein shaped body S1, forming cavity between two shaped bodies, c) introducing one-component thermosetting epoxy resin compositions into cavity, wherein one-component thermosetting epoxy resin composition is one-component thermosetting epoxy resin composition including: at least one epoxy resin A having average of more than one epoxy group per molecule; at least one curing agent B for epoxy resins activated by elevated temperature; at least one polyester polyol PP obtainable by reaction of at least one diol having structure HO—(CH2)x′—OH the value of x′=2-10, and —at least one dicarboxylic acid having structure HOOC—(CH2)y′—COOH and derivatives of dicarboxylic acid, value of y′=8-18, and wherein proportion of polyester polyol PP is 1.5% to 20% by weight, based on total weight of one-component thermosetting epoxy resin composition.
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