Invention Grant
- Patent Title: Fracturing method and depressurizing device used for same
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Application No.: US16967035Application Date: 2019-01-31
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Publication No.: US11326433B2Publication Date: 2022-05-10
- Inventor: Hiroshi Asanuma , Shigemi Naganawa , Noriyoshi Tsuchiya , Tatsuya Kajiwara , Kuniaki Shimada
- Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY , THE UNIVERSITY OF TOKYO , TOHOKU UNIVERSITY , JMC GEOTHERMAL ENGINEERING CO., LTD. , INPEX DRILLING CO., LTD.
- Applicant Address: JP Tokyo; JP Tokyo; JP Sendai; JP Takizawa; JP Tokyo
- Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY,THE UNIVERSITY OF TOKYO,TOHOKU UNIVERSITY,JMC GEOTHERMAL ENGINEERING CO., LTD.,INPEX DRILLING CO., LTD.
- Current Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY,THE UNIVERSITY OF TOKYO,TOHOKU UNIVERSITY,JMC GEOTHERMAL ENGINEERING CO., LTD.,INPEX DRILLING CO., LTD.
- Current Assignee Address: JP Tokyo; JP Tokyo; JP Sendai; JP Takizawa; JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JPJP2018-018477 20180205
- International Application: PCT/JP2019/003490 WO 20190131
- International Announcement: WO2019/151443 WO 20190808
- Main IPC: E21B43/26
- IPC: E21B43/26 ; E21B33/12 ; E21B34/16

Abstract:
A fracturing method, to cause a crack in bedrock, includes installing a depressurizing device in a well in the bedrock, and depressurizing the inside of the well with the installed depressurizing device. The installing step includes installing, in the well, a connecting pipe, which is connected to the depressurizing device, and a packer, which is attached to the connecting pipe, and the depressurizing step includes shutting off a gap between the well and the connecting pipe, with the packer, and depressurizing a region in the well below the packer, with the depressurizing device.
Public/Granted literature
- US20210040831A1 FRACTURING METHOD AND DEPRESSURIZING DEVICE USED FOR SAME Public/Granted day:2021-02-11
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