Invention Grant
- Patent Title: Method for measuring thermal resistance between a thermal component of an instrument and a consumable
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Application No.: US16937781Application Date: 2020-07-24
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Publication No.: US11327035B2Publication Date: 2022-05-10
- Inventor: W. Craig Bauer
- Applicant: ILLUMINA, INC.
- Applicant Address: US CA San Diego
- Assignee: ILLUMINA, INC.
- Current Assignee: ILLUMINA, INC.
- Current Assignee Address: US CA San Diego
- Agency: Frost Brown Todd LLC
- Priority: NL2023792 20190906
- Main IPC: G01N25/00
- IPC: G01N25/00 ; G01K1/00 ; G01N25/18 ; G01N25/72

Abstract:
A method for measuring thermal resistance between a thermal component of an instrument and a consumable includes contacting a known consumable with a thermal component to be tested; driving the thermal component using a periodic sine wave input based on a predetermined interrogation frequency; measuring temperature outputs from a thermal sensor responsive to the periodic sine wave input; multiplying the temperature outputs by a reference signal in phase with the periodic sine wave input and calculating the resultant DC signal component to determine an in-phase component X; multiplying the plurality of temperature outputs by a 90° phase-shifted reference signal and calculating the resultant DC signal component to determine a quadrature, out-of-phase component Y; calculating a phase offset responsive to the periodic sine wave input based on tan−1 (Y/X) or a tan 2(X,Y); and determining a resistance value for the thermal interface using a calibrated resistance-phase offset equation and the calculated phase offset.
Public/Granted literature
- US20210048400A1 METHOD FOR MEASURING THERMAL RESISTANCE BETWEEN A THERMAL COMPONENT OF AN INSTRUMENT AND A CONSUMABLE Public/Granted day:2021-02-18
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