Invention Grant
- Patent Title: Method of direct etching fabrication of waveguide combiners
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Application No.: US16762869Application Date: 2018-11-13
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Publication No.: US11327218B2Publication Date: 2022-05-10
- Inventor: Michael Yu-tak Young , Wayne McMillan , Rutger Meyer Timmerman Thijssen , Robert Jan Visser
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- International Application: PCT/US2018/060651 WO 20181113
- International Announcement: WO2019/108379 WO 20190606
- Main IPC: G03F7/00
- IPC: G03F7/00 ; B44C1/22 ; F21V8/00

Abstract:
Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.
Public/Granted literature
- US20200301062A1 METHOD OF DIRECT ETCHING FABRICATION OF WAVEGUIDE COMBINERS Public/Granted day:2020-09-24
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