Invention Grant
- Patent Title: Integration of photonic components on SOI platform
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Application No.: US17055114Application Date: 2019-05-14
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Publication No.: US11327343B2Publication Date: 2022-05-10
- Inventor: Guomin Yu , Aaron John Zilkie
- Applicant: ROCKLEY PHOTONICS LIMITED
- Applicant Address: GB Altrincham
- Assignee: ROCKLEY PHOTONICS LIMITED
- Current Assignee: ROCKLEY PHOTONICS LIMITED
- Current Assignee Address: GB Altrincham
- Agency: Lewis Roca Rothgerber Christie LLP
- International Application: PCT/EP2019/062374 WO 20190514
- International Announcement: WO2019/219703 WO 20191121
- Main IPC: G02F1/017
- IPC: G02F1/017 ; G02B6/12 ; G02F1/015 ; G02F1/025

Abstract:
An electro-optically active device comprising: a silicon on insulator (SOI) substrate including a silicon base layer, a buried oxide (BOX) layer on top of the silicon base layer, a silicon on insulator (SOI) layer on top of the BOX layer, and a substrate cavity which extends through the SOI layer, the BOX layer and into the silicon base layer, such that a base of the substrate cavity is formed by a portion of the silicon base layer; an electro-optically active waveguide including an electro-optically active stack within the substrate cavity; and a buffer region within the substrate cavity beneath the electro-optically active waveguide, the buffer region comprising a layer of Ge and a layer of GaAs.
Public/Granted literature
- US20210271119A1 INTEGRATION OF PHOTONIC COMPONENTS ON SOI PLATFORM Public/Granted day:2021-09-02
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