Invention Grant
- Patent Title: Patterning process
-
Application No.: US16194593Application Date: 2018-11-19
-
Publication No.: US11327400B2Publication Date: 2022-05-10
- Inventor: Jun Hatakeyama , Takeshi Sasami , Tomohiro Kobayashi
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JPJP2017-229144 20171129
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/40 ; G03F7/38 ; G03F7/32 ; G03F7/004

Abstract:
A pattern having a good balance of sensitivity, resolution and LWR is formed by providing a resist film comprising a base resin comprising recurring units having a C4-C6 tertiary alkoxy or alkoxycarbonyl group as an acid labile group and recurring units capable of generating a backbone-bound acid upon exposure, exposing the resist film to radiation, optionally post-exposure baking the resist film at a low temperature of 30-70° C., and developing the film.
Public/Granted literature
- US20190163065A1 PATTERNING PROCESS Public/Granted day:2019-05-30
Information query
IPC分类: