- Patent Title: Information processing apparatus, information processing method, and information processing system for haptic feedback presentation based on electronic information
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Application No.: US17087689Application Date: 2020-11-03
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Publication No.: US11327568B2Publication Date: 2022-05-10
- Inventor: Mikio Takenaka , Ryosuke Murakami , Hideaki Hayashi , Akira Ono , Ryo Yokoyama , Ryosuke Takeuchi , Seiji Muramatsu , Mioko Ambe , Kazutoshi Ohno , Tetsuya Naruse , Tetsuya Takahashi
- Applicant: SONY CORPORATION , SONY MOBILE COMMUNICATION INC.
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: SONY CORPORATION,SONY MOBILE COMMUNICATION INC.
- Current Assignee: SONY CORPORATION,SONY MOBILE COMMUNICATION INC.
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Chip Law Group
- Priority: JPJP2016-179144 20160914
- Main IPC: G06F3/01
- IPC: G06F3/01 ; H04M1/72454 ; G01R31/36 ; G06Q20/36
Abstract:
An information processing apparatus according to the present technology includes an information acquisition unit and a signal output unit. The information acquisition unit acquires electronic information. The signal output unit outputs a first haptic signal for presenting haptic feedback with respect to an object, the haptic feedback with respect to the object being set corresponding to the acquired electronic information.
Public/Granted literature
Information query
