Invention Grant
- Patent Title: CPU hot-swapping
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Application No.: US17041519Application Date: 2018-06-29
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Publication No.: US11327918B2Publication Date: 2022-05-10
- Inventor: Zhi Yong Chen , Sarathy Jayakumar , Yi Zeng , Wenjuan Mao , Anil Agrawal
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- International Application: PCT/CN2018/093592 WO 20180629
- International Announcement: WO2020/000354 WO 20200102
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F9/4401 ; G06F11/20

Abstract:
There is disclosed in one example a multi-core computing system configured to provide a hot-swappable CPU0, including: a first CPU in a first CPU socket and a second CPU in a second CPU socket; a switch including a first media interface to the first CPU socket and a second media interface to the second CPU socket; and one or more mediums including non-transitory instructions to detect a hot swap event of the first CPU, designate the second CPU as CPU0, determine that a new CPU has replaced the first CPU, operate the switch to communicatively couple the new CPU to a backup initialization code store via the first media interface, initialize the new CPU, and designate the new CPU as CPUN, wherein N≠0.
Public/Granted literature
- US20210209052A1 CPU HOT-SWAPPING Public/Granted day:2021-07-08
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