Invention Grant
- Patent Title: System and method for automated microstructure analysis
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Application No.: US16810129Application Date: 2020-03-05
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Publication No.: US11328406B2Publication Date: 2022-05-10
- Inventor: Arindam Dasgupta , Biswadip Dey , Anand A. Kulkarni , Amit Chakraborty
- Applicant: Siemens Aktiengesellschaft
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T7/62 ; G06T5/00 ; G06N20/00

Abstract:
A computer-implemented method for assessing material microstructure of a machine component involves obtaining a raw image of a section of the component captured via a microscope. The method further includes pre-processing the raw image to generate a ternary image defined by pixel data including three levels of intensities. The method further includes identifying, from the ternary image, phase boundaries delineating at a phase in a primary constituent material of the component. The method further includes determining a volume associated with the phase based on the identified phase boundaries. The proposed method may be utilized, for example, as an automated tool for assessing material degradation and for quality control of gas turbine engine components.
Public/Granted literature
- US20210279853A1 SYSTEM AND METHOD FOR AUTOMATED MICROSTRUCTURE ANALYSIS Public/Granted day:2021-09-09
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