Invention Grant
- Patent Title: Soft magnetic alloy and magnetic device
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Application No.: US15881118Application Date: 2018-01-26
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Publication No.: US11328847B2Publication Date: 2022-05-10
- Inventor: Akihiro Harada , Hiroyuki Matsumoto , Kenji Horino , Kazuhiro Yoshidome , Akito Hasegawa , Hajime Amano , Kensuke Ara , Seigo Tokoro , Shota Otsuka
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2017-014776 20170130
- Main IPC: H01F1/153
- IPC: H01F1/153 ; C22C45/00 ; C22C38/00 ; C22C38/12 ; C22C38/14 ; C22C38/16 ; C22C45/02

Abstract:
A soft magnetic alloy including a compositional formula of ((Fe(1−(α+β))X1αX2β)(1−(a+b+c+e))MaBbPcCue)1−fCf, wherein X1 is one or more selected from the group consisting Co and Ni, X2 is one or more selected from the group consisting of Al, Mn, Ag, Zn, Sn, As, Sb, Bi, N, O, and rare earth elements, “M” is one or more selected from the group consisting of Nb, Hf, Zr, Ta, Ti, Mo, W, and V, 0.030
Public/Granted literature
- US20180218812A1 SOFT MAGNETIC ALLOY AND MAGNETIC DEVICE Public/Granted day:2018-08-02
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