Invention Grant
- Patent Title: Electronic component and manufacturing method for electronic component
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Application No.: US16255900Application Date: 2019-01-24
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Publication No.: US11328854B2Publication Date: 2022-05-10
- Inventor: Sumiyo Nakamura , Jun Adachi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2016-193888 20160930
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/29 ; H01F27/34 ; H01F41/12 ; H01F27/32 ; H01F41/04 ; H01C7/12 ; H01C1/148 ; H01C17/28 ; H01F17/00

Abstract:
An electronic component includes a ceramic element body including glass, and outer electrodes provided on the ceramic element body. Each of the outer electrodes includes a base electrode layer on the ceramic element body and a buffer portion to buffer an impact. The base electrode layer includes a first region that is disposed on the ceramic element body and includes the buffer portion of equal to or more than about 15 vol % and equal to or less than about 50 vol %, and a second region that covers the first region and includes the buffer portion of equal to or more than about 1 vol % and equal to or less than about 10 vol %.
Public/Granted literature
- US20190156988A1 ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT Public/Granted day:2019-05-23
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