Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16800834Application Date: 2020-02-25
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Publication No.: US11328957B2Publication Date: 2022-05-10
- Inventor: Shih-Wei Peng , Wei-Cheng Lin , Jiann-Tyng Tzeng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L29/10 ; H01L29/66 ; H01L29/78

Abstract:
A device includes a first transistor, a second transistor, and a contact. The first transistor includes a first source/drain, a second source/drain, and a first gate between the first and second source/drains. The second transistor includes a third source/drain, a fourth source/drain, and a second gate between the third and fourth source/drains. The contact covers the first source/drain of the first transistor and the third source/drain of the second transistor. The contact is electrically connected to the first source/drain of the first transistor and electrically isolated from the third source/drain of the second transistor.
Public/Granted literature
- US20210265217A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-08-26
Information query
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