Invention Grant
- Patent Title: Temporary bonding scheme
-
Application No.: US16237140Application Date: 2018-12-31
-
Publication No.: US11328972B2Publication Date: 2022-05-10
- Inventor: Wan-Yu Lee , Ying-Hao Kuo , Kuo-Chung Yee
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L23/31 ; H01L23/544 ; H01L23/00 ; H01L21/56 ; H01L23/29
Abstract:
A method includes filling a trench formed in a first integrated circuit carrier with temporary bonding material to form a temporary bonding layer. At least one chip is bonded over the temporary bonding layer.
Public/Granted literature
- US20190139850A1 Temporary Bonding Scheme Public/Granted day:2019-05-09
Information query
IPC分类:
