Invention Grant
- Patent Title: Semiconductor device package with warpage control structure
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Application No.: US16900815Application Date: 2020-06-12
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Publication No.: US11329006B2Publication Date: 2022-05-10
- Inventor: Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Kuo-Chuan Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/36 ; H01L23/40 ; H01L23/31
Abstract:
Between an adhesive surface of a heat spreader lid and a top surface of a semiconductor package, in addition to a spreader adhesive layer, several warpage control adhesive layers are also provided. The warpage control adhesive layers are disposed on corner areas of the adhesive surface of the heat spreader lid to reduce high temperature warpage of the semiconductor device package.
Public/Granted literature
- US20200312790A1 SEMICONDUCTOR DEVICE PACKAGE WITH WARPAGE CONTROL STRUCTURE Public/Granted day:2020-10-01
Information query
IPC分类:
