Invention Grant
- Patent Title: Method for producing a semiconductor device, and semiconductor device
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Application No.: US17012902Application Date: 2020-09-04
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Publication No.: US11329009B2Publication Date: 2022-05-10
- Inventor: Stefan Klockenkaemper , Martin Schulz , Ajay Kumar Tejaswi Konakanchi
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102019124219.3 20190910,DE102020100584.9 20200113
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/367 ; H01L23/473 ; H01L23/58 ; H01L21/50
Abstract:
A method for producing a semiconductor device includes providing a carrier configured to carry at least one semiconductor chip on a first side, and dispensing a polymer onto a second side situated opposite the first side in order to produce a sealing ring. The polymer is dispensed in such a way that the sealing ring produced has different heights perpendicular to the second side along its circumference.
Public/Granted literature
- US20210074654A1 METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Public/Granted day:2021-03-11
Information query
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