- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US16789236Application Date: 2020-02-12
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Publication No.: US11329015B2Publication Date: 2022-05-10
- Inventor: Meng-Wei Hsieh
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/66 ; H01L21/48 ; H01L23/498 ; H01Q1/22
Abstract:
A semiconductor device package includes an emitting device and a first building-up circuit. The emitting device defines a cavity in the emitting device. The first building-up circuit is disposed on the emitting device.
Public/Granted literature
- US20210249367A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-08-12
Information query
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