Invention Grant
- Patent Title: Tetherless chip module
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Application No.: US16850907Application Date: 2020-04-16
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Publication No.: US11329035B2Publication Date: 2022-05-10
- Inventor: Frank Robert Libsch , Ghavam G. Shahidi
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Otterstedt, Wallace & Kammer, LLP
- Agent Daniel Morris
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L27/105

Abstract:
Attach a smart chip to a carrier, and attach a memory chip to the carrier in communication with the smart chip. The memory chip has a larger footprint than the smart chip, overlies the smart chip, and is attached to the carrier by connections around the periphery of the smart chip. Removably attach an energy storage device (ESD) to the carrier and electrically connect the ESD to the carrier via a flex bridge.
Public/Granted literature
- US20210327860A1 TETHERLESS CHIP MODULE Public/Granted day:2021-10-21
Information query
IPC分类: