- Patent Title: Semiconductor device and methods of forming and operating the same
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Application No.: US16844044Application Date: 2020-04-09
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Publication No.: US11329055B2Publication Date: 2022-05-10
- Inventor: Nan Wang
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation , Semiconductor Manufacturing International (Beijing) Corporation
- Applicant Address: CN Shanghai; CN Beijing
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation,Semiconductor Manufacturing International (Beijing) Corporation
- Current Assignee Address: CN Shanghai; CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201910295393.6 20190412
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L29/06 ; H01L29/08

Abstract:
Semiconductor cell and its forming method and operating method are provided. The semiconductor device includes: a substrate with a first region; a first nanopillar, formed on a substrate surface of the first region and perpendicular to the substrate surface; a first source/drain region, formed at a bottom of the first nanopillar and in a portion of the substrate in the first region; a first gate structure, surrounding the first nanopillar and formed on the first source/drain region; and a second source/drain region, formed at a top of the first nanopillar and on the first gate structure.
Public/Granted literature
- US20200328217A1 SEMICONDUCTOR DEVICE AND METHODS OF FORMING AND OPERATING THE SAME Public/Granted day:2020-10-15
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