Invention Grant
- Patent Title: Fingerprint sensing module
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Application No.: US17004017Application Date: 2020-08-27
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Publication No.: US11329096B2Publication Date: 2022-05-10
- Inventor: Tzu-Yang Peng , Ming-Yuan Cheng , Chung-Yi Wang , Yu-Hsuan Lin
- Applicant: Egis Technology Inc.
- Applicant Address: TW Taipei
- Assignee: Egis Technology Inc.
- Current Assignee: Egis Technology Inc.
- Current Assignee Address: TW Taipei
- Agency: JCIPRNET
- Priority: CN202010601525.6 20200629
- Main IPC: H01L27/146
- IPC: H01L27/146 ; G06V40/13

Abstract:
A fingerprint sensing module including an image sensor, a microlens array and a light-shielding layer is provided. The image sensor has multiple pixels. Each of the pixels has multiple light-sensing regions physically separated. Each of the light-sensing regions is adapted to receive an image beam coming from a fingerprint of user. The microlens array is disposed above the image sensor. The microlens array includes multiple microlens. A focus region of each of the microlens covers a portion of the light-sensing regions. The light-shielding layer is disposed between the image sensor and the microlens array. The light-shielding layer has multiple openings, and the positions of the openings are corresponded to the positions of the pixels.
Public/Granted literature
- US20210225926A1 FINGERPRINT SENSING MODULE Public/Granted day:2021-07-22
Information query
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