Invention Grant
- Patent Title: Integrated circuit structures having differentiated neighboring partitioned source or drain contact structures
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Application No.: US16122277Application Date: 2018-09-05
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Publication No.: US11329162B2Publication Date: 2022-05-10
- Inventor: Mauro J. Kobrinsky , Stephanie Bojarski , Myra McDonnell , Tahir Ghani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L27/092 ; H01L29/06 ; H01L29/417 ; H01L29/423 ; H01L21/02 ; H01L21/8238

Abstract:
Integrated circuit structures having differentiated neighboring partitioned source or drain contact structures are described. An integrated circuit structure includes a first gate stack over a first fin, and a second gate stack over a second fin. First and second epitaxial source or drain structures are at first and second ends of the first fin. Third and fourth epitaxial source or drain structures are at first and second ends of the second fin. A first conductive contact structure is coupled to one of the first or the second epitaxial source or drain structures, and has a first portion partitioned from a second portion. A second conductive contact structure is coupled to one of the third or the fourth epitaxial source or drain structures, and has a first portion partitioned from a second portion. The second conductive contact structure is neighboring the first conductive contact structure and has a composition different than a composition of the first conductive contact structure.
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