Invention Grant
- Patent Title: Engagement structure of cover and block member, electronic component module, electrical connection box, and wire harness
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Application No.: US16600413Application Date: 2019-10-11
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Publication No.: US11329462B2Publication Date: 2022-05-10
- Inventor: Yoshihito Imaizumi , Jun Sato , Seiju Kawamata , Toshibumi Shiohata
- Applicant: YAZAKI CORPORATION , HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: YAZAKI CORPORATION,HONDA MOTOR CO., LTD.
- Current Assignee: YAZAKI CORPORATION,HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JPJP2018-194887 20181016
- Main IPC: H02G3/08
- IPC: H02G3/08 ; H01R12/58 ; H05K5/00 ; B60R16/023 ; H05K5/03 ; H05K7/02 ; H02G3/14 ; H05K5/02

Abstract:
An engagement structure includes a cover having an opening portion, a block member inserted into the opening portion, an engagement mechanism configured to engage the block member with the opening portion, and an engagement stabilization mechanism configured to stabilize an engagement state of the engagement mechanism. The engagement stabilization mechanism includes a first stabilization mechanism and a second stabilization mechanism. The first stabilization mechanism permits excessive insertion due to backlash that occurs in the engagement mechanism and to restore the excessive insertion after the block member is engaged with the opening portion. The second stabilization mechanism performs a slide engagement between the block member and the opening portion and to restrict a wall inner surface of the cover from moving away from an outer surface of a side portion of the block member after the slide engagement is completed.
Information query
IPC分类: