Invention Grant
- Patent Title: Radio frequency module and communication device
-
Application No.: US17195684Application Date: 2021-03-09
-
Publication No.: US11329676B2Publication Date: 2022-05-10
- Inventor: Kazuhito Nakai , Satoshi Goto , Hidetaka Takahashi , Daerok Oh
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2020-044191 20200313
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H04B1/03 ; H04B1/58

Abstract:
A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying element; a second amplifying element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying element, another end of the primary coil is connected to an output terminal of the second amplifying element, an end of the secondary coil is connected to an output terminal of the power amplifier, the first amplifying element and the second amplifying element are disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.
Public/Granted literature
- US20210288683A1 RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-09-16
Information query