Invention Grant
- Patent Title: Multi-layer electromagnetic coupler arrangement
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Application No.: US15756287Application Date: 2015-11-27
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Publication No.: US11329697B2Publication Date: 2022-05-10
- Inventor: Markus Frank , Mats Hedberg
- Applicant: SATO HOLDINGS KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: SATO HOLDINGS KABUSHIKI KAISHA
- Current Assignee: SATO HOLDINGS KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: WHDA, LLP
- International Application: PCT/EP2015/077931 WO 20151127
- International Announcement: WO2017/088933 WO 20170601
- Main IPC: H04B5/00
- IPC: H04B5/00 ; G06K7/10 ; H02J50/10

Abstract:
The present invention broadly relates to a multi-layer electromagnetic coupler arrangement, for encoding an RFID tag, suitable for being used in a printing device. The coupler arrangement employs a differential transmission line loop, as a coupling element arranged on a top surface layer of the multi-layer arrangement, which is arranged close to a metallic ground plane layer for shielding on the side opposite the top surface. Coupling is achieved by inductive coupling in the reactive near field and based on the fact that each RFID tag comprises a current loop, itself. The differential property of the transmission line loop is achieved by feeding the terminals of the loop with signal parts having a phase shift of 180° with respect to each other. The feeding components are arranged on the opposite side of the ground plane with respect to the top surface layer comprising the current loop. It is possible to arrange plural differential transmission line loops on the top surface layer, in form of a one-or two-dimensional array.
Public/Granted literature
- US20180254803A1 MULTI-LAYER ELECTROMAGNETIC COUPLER ARRANGEMENT Public/Granted day:2018-09-06
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