Invention Grant
- Patent Title: Heated substrate support
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Application No.: US16189810Application Date: 2018-11-13
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Publication No.: US11330673B2Publication Date: 2022-05-10
- Inventor: Govinda Raj
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H05B3/14
- IPC: H05B3/14 ; H01L21/67 ; H05B1/02 ; H01L21/687

Abstract:
A heater for a semiconductor processing chamber is disclosed that includes a ceramic body, and a resistive heating element embedded in the ceramic body, the resistive heating element disposed in a heater coil having an inner central sector and an outer central sector, the inner central sector having a plurality of first peaks and the outer central sector having a plurality of second peaks, wherein the number of first peaks is less than about fifty-six, and the number of second peaks is less than about eighty.
Public/Granted literature
- US20190159292A1 HEATED SUBSTRATE SUPPORT Public/Granted day:2019-05-23
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