Invention Grant
- Patent Title: Modular design of blind mate interface for liquid cooling
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Application No.: US16830533Application Date: 2020-03-26
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Publication No.: US11330741B2Publication Date: 2022-05-10
- Inventor: Shuai Shao , Tianyi Gao
- Applicant: Baidu USA LLC
- Applicant Address: US CA Sunnyvale
- Assignee: Baidu USA LLC
- Current Assignee: Baidu USA LLC
- Current Assignee Address: US CA Sunnyvale
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/14
Abstract:
A fluid connector includes an adapter panel defining at least two mounting holes configured to be secured to a mounting rail of a server chassis. The fluid connector also includes an interior connector configured to fluidly communicate with a cooling module of a server, and a blind mate connector extending from the adapter panel and configured to fluidly connect with a port of a rack manifold.
Public/Granted literature
- US20210307208A1 MODULAR DESIGN OF BLIND MATE INTERFACE FOR LIQUID COOLING Public/Granted day:2021-09-30
Information query
