Invention Grant
- Patent Title: Disassembly apparatus
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Application No.: US16845758Application Date: 2020-04-10
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Publication No.: US11330747B2Publication Date: 2022-05-10
- Inventor: Scott Jader , Leroy Thiel
- Applicant: Data Security, Inc.
- Applicant Address: US NE Lincoln
- Assignee: Data Security, Inc.
- Current Assignee: Data Security, Inc.
- Current Assignee Address: US NE Lincoln
- Agency: Fitch, Even, Tabin and Flannery LLP
- Main IPC: H05K13/04
- IPC: H05K13/04 ; H05K13/08

Abstract:
An apparatus and method for dissembling electronic devices are described. The apparatus includes a housing with an aperture providing access to an interior thereof, and an adjustable support assembly positioned therein. The support assembly includes a first side plate and a second side plate with spacing in between, and a base plate for supporting an electronic device. A user interface is provided for receiving a user input, and in response to the user input, a motor is configured to drive a ram member downwards to contact and apply force to the electronic device held in the support assembly. A sensor may be included to measure the motor load current and output the measured load to an indicator to be viewed by a user for determining when a shell of the electronic device has been cracked.
Public/Granted literature
- US20200329595A1 Disassembly Apparatus Public/Granted day:2020-10-15
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