Invention Grant
- Patent Title: Electronic component mounting apparatus
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Application No.: US16620671Application Date: 2017-06-26
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Publication No.: US11330750B2Publication Date: 2022-05-10
- Inventor: Naohiro Kato
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2017/023354 WO 20170626
- International Announcement: WO2019/003261 WO 20190103
- Main IPC: H05K13/08
- IPC: H05K13/08 ; H05K13/04

Abstract:
An electronic component mounting device including a component holding device to hold and mount on a board an electronic component supplied by a component supply device; a motor to drive the component holding device; a motor control device to control the motor; a load measurement device to measure a load applied from the component holding device upon being pressed by the component holding device while the component holding device performs the same operation as when mounting an electronic component on a board, by replacing the board with the load measurement device; a motor information acquisition section to obtain motor information corresponding to the force with which the motor drives the component holding device in the pressing direction against the load measurement device while the motor control device performs the same operation as when mounting an electronic component on the board, by replacing the board with the load measurement device.
Public/Granted literature
- US20210144893A1 ELECTRONIC COMPONENT MOUNTING APPARATUS Public/Granted day:2021-05-13
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