Invention Grant
- Patent Title: Method for machining a cutting insert and corresponding device for machining a cutting insert
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Application No.: US16469273Application Date: 2017-12-08
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Publication No.: US11331748B2Publication Date: 2022-05-17
- Inventor: Martin Reisacher , Peter Hildebrand
- Applicant: SAUER GmbH
- Applicant Address: DE Stipshausen
- Assignee: SAUER GmbH
- Current Assignee: SAUER GmbH
- Current Assignee Address: DE Stipshausen
- Agency: Henricks Slavin LLP
- Priority: DE102016225602.5 20161220
- International Application: PCT/EP2017/081997 WO 20171208
- International Announcement: WO2018/114390 WO 20180628
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/03 ; B23K26/38 ; B23K26/402 ; B23K103/16

Abstract:
The invention relates to a method for machining a multi-layer workpiece blank (3) by means of a laser beam, comprising the following steps: specifying a machining program for machining the workpiece blank according to an ablation geometry in order to generate a desired edge and/or surface geometry (13) using a laser machining device; tensioning the workpiece blank in the laser machining device and positioning the workpiece holder in a measuring position; measuring a thickness of at least one of the layers of the multi-layer workpiece blank (3); modifying the machining program in order to machine the multi-layer workpiece blank (3) according to the measured layer thickness with an consistent ablation geometry; and machining the tensioned workpiece blank (3) using the modified machining program via a laser of the laser machining device in order to generate the desired edge and/or surface geometry (13) with a cutting edge (12). The invention also relates to a correspondingly configured device.
Public/Granted literature
- US20190351504A1 Method For Machining a Cutting Insert and Corresponding Device For Machining a Cutting Insert Public/Granted day:2019-11-21
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