Invention Grant
- Patent Title: Sintered compact, circuit component, and method of producing sintered compact
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Application No.: US16776874Application Date: 2020-01-30
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Publication No.: US11332410B2Publication Date: 2022-05-17
- Inventor: Kyohei Atsuji , Noboru Nishimura , Yuji Katsuda
- Applicant: NGK INSULATORS, LTD.
- Applicant Address: JP Nagoya
- Assignee: NGK INSULATORS, LTD.
- Current Assignee: NGK INSULATORS, LTD.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Main IPC: C04B35/626
- IPC: C04B35/626 ; C04B35/109 ; C04B35/65 ; C04B35/111 ; H01B3/12 ; H01L23/15 ; H05K3/46
Abstract:
A sintered compact includes an alumina phase as a primary phase, and further includes an amorphous phase containing Si and Mn and a cordierite phase. The sintered compact has a porosity of higher than or equal to 1.1% and less than or equal to 5.0%. Preferably, I1/(I1+I2) is greater than or equal to 0.20 and less than or equal to 0.45, where I1 is the strength of the main peak of cordierite obtained by an XRD method, and I2 is the strength of the main peak of alumina.
Public/Granted literature
- US20200165168A1 SINTERED COMPACT, CIRCUIT COMPONENT, AND METHOD OF PRODUCING SINTERED COMPACT Public/Granted day:2020-05-28
Information query
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