The present invention relates to hot melt adhesive compositions comprising ethylene vinyl acetate copolymer(s) and isothiazolinone fungicides according to formula (I). Such hot melt adhesives show improved fungus resistance and are thus particularly suited for applications where such properties are desirable, such as ventilation and air-conditioning systems and air filters. The invention further relates to the use of said hot melt adhesives in such ventilation and air-conditioning systems and air filters as well as for bonding, stabilizing and sealing of pleats, edge and frame bonding, or seam sealing of bag filters. Further encompassed are air filters comprising the hot melt adhesives and methods of their manufacture using the hot melt adhesives of the invention.