Invention Grant
- Patent Title: Pressure sensitive adhesive assembly comprising thermoplastic filler material
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Application No.: US15316995Application Date: 2015-07-09
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Publication No.: US11332648B2Publication Date: 2022-05-17
- Inventor: Jan Heimink , Kerstin Unverhau , Jan D. Forster
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agency: 3M Innovative Properties Company
- Agent Carlos M. Téllez Rodriguez
- Priority: EP14177531 20140717
- International Application: PCT/US2015/039645 WO 20150709
- International Announcement: WO2016/010803 WO 20160121
- Main IPC: C09J133/08
- IPC: C09J133/08 ; C09J7/26 ; B32B5/18 ; B32B27/06 ; B32B37/06 ; B32B37/12

Abstract:
The present disclosure relates to a pressure sensitive adhesive assembly suitable for bonding to a substrate provided with an uneven surface, wherein the pressure sensitive adhesive assembly comprises a polymeric foam layer comprising a polymeric base material and a particulate filler material comprising a thermoplastic material, and wherein the polymeric foam layer has a complex viscosity comprised between 2,000 Pa·s to 80,000 Pa·s, when measured at 120 C according to the test method described in the experimental section. The present disclosure is also directed to a method of applying a pressure sensitive adhesive assembly to a substrate provided with an uneven surface, and uses thereof.
Public/Granted literature
- US20170130101A1 PRESSURE SENSITIVE ADHESIVE ASSEMBLY COMPRISING THERMOPLASTIC FILLER MATERIAL Public/Granted day:2017-05-11
Information query
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